XIAO ESP32S3 & Wio-SX1262 Kit with 3D case for Meshtastic & LoRa

Features: High RF Performance: Supports LoRa (862–930 MHz), 2.4 GHz Wi-Fi, and BLE 5.0 dual-wireless communication. When connected to an external antenna, it enables remote communication over a distance of 2–5 km (LoRa) and 100 m (Wi-Fi/BLE). LoRaWAN Hub: Pre-flashed with single-channel LoRaWAN, it is ready to work once powered on. 3D Casing Design: Measuring 22 × 23 × 57 mm, this device features a black ABS enclosure with a wide operating temperature range (-40 ℃ to 100 ℃), making it ideal for outdoor and space-constrained projects. Powerful MCU Board: Incorporates the ESP32-S3 32-bit dual-core Xtensa processor running up to 240 MHz, equipped with multiple development ports, and compatible with Arduino and MicroPython. Elaborate Power Design: Includes a Type-C USB interface, multiple GPIO/I²C/UART ports, and lithium battery charge management. Versatile Hardware for Multiple Applications: Can be developed into a node or router for Meshtastic, a single-channel LoRaWAN gateway, or a LoRa/LoRaWAN sensor device.